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Copyright © 2012 X. D. Zhang et al. X. D. Zhang et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

This paper reviews results obtained by the research groups developing the low-energy high-current pulsed electron beam (LEHCPEB) in Dalian (China) and Metz (France) on the surface treatment of light alloys. The pulsed electron irradiation induces an ultra-fast thermal cycle at the surface combined with the formation of thermal stress and shock waves. As illustrated for Mg alloys and Ti, this results in deep subsurface hardening (over several 100 μm) which improves the wear resistance. The analysis of the top surface melted surface of light alloys also often witnesses evaporation and condensation of chemical species. This phenomenon can significantly modify the melt chemistry and was also suggested to lead to the development of specific solidification textures in the rapidly solidified layer. The potential use of the LEHCPEB technique for producing thermomechanical treatments under the so-called heating mode and, thus, modify the surface crystallographic texture, and enhance solid-state diffusion is also demonstrated in the case of the FeAl intermetallic compound.

Details

Title
Surface Modification of Light Alloys by Low-Energy High-Current Pulsed Electron Beam
Author
Zhang, X D; Hao, S Z; Grosdidier, T; Zou, J X; Gao, B; Bolle, B; Allain-Bonasso, N; Qin, Y; Li, X N; Dong, C
Publication year
2012
Publication date
2012
Publisher
Hindawi Limited
ISSN
16879465
e-ISSN
16879473
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
1000372589
Copyright
Copyright © 2012 X. D. Zhang et al. X. D. Zhang et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.