- Preview Available
- Scholarly Journal
Micro-drilling of silicon wafer by industrial CO2 laser
International Journal of Mechanical and Materials Engineering; Heidelberg Vol. 10, Iss. 1, (Dec 2015): 2.
DOI:10.1186/s40712-015-0029-8
This is a limited preview of the full PDF
Try and log in through your library or institution to see if they have access.