Electronics and Photonics Packaging Solutions for Emerging Applications

Abstract

The need for novel electronics and photonics packaging solutions is widening as the application of these technologies expands to new geometries and situations. This multi-monograph dissertation will address two thermodynamic packaging challenges as part of UMass Lowell’s Harnessing Emerging Research Opportunities to Empower Soldiers (HEROES) partnership with the US Army and one photonics packaging solution in a collaboration with MIT Lincoln Laboratory. First, a conformal thermoelectric cooler was developed to provide personal active cooling for military and civilian use. Second, an improved electroosmotic pump was designed and integrated with fabric to manage moisture in garments and shelters. Finally, a laser fusion splice process for fiber-to-chip photonics attachment was evaluated and optimized. The results of this research include deliverable products and new packaging processes to help physicists and engineers widen the application of electronic and photonic devices.