Micromachined quantum circuits

Abstract

Quantum computers will potentially outperform classical computers for certain applications by employing quantum states to store and process information. However, algorithms using quantum states are prone to errors through continuous decay, posing unique challenges to engineering a quantum system with enough quantum bits and sufficient controls to solve interesting problems. A promising platform for implementing quantum computers is that of circuit quantum electrodynamics (cQED) using superconducting qubits. Here, two energy levels of a resonant circuit endowed with a Josephson junction serve as the qubit, which is coupled to a microwave-frequency electromagnetic resonator. Modern quantum circuits are reaching size and complexity that puts extreme demands on input/output connections as well as selective isolation among internal elements. Continued progress will require adapting sophisticated 3D integration and RF packaging techniques found in today's high-density classical devices to the cQED platform. This novel technology will take the form of multilayer microwave integrated quantum circuits (MMIQCs), combining the superb coherence of three-dimensional structures with the advantages of lithographic integrated circuit fabrication. Several design and fabrication techniques are essential to this new physical architecture, notably micromachining, superconducting wafer bonding, and out-of-plane qubit coupling. This thesis explores these techniques and culminates in the design, fabrication, and measurement of a two-cavity/one-qubit MMIQC featuring qubit coupling to a superconducting micromachined cavity resonator in silicon wafers. Current prototypes are extensible to larger scale MMIQCs for scalable quantum information processing.