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Taiwan Semiconductor Manufacturing Company (TSE:2330) (NYSE:TSM), has announced new production data on its 0.13-micron processes as well as its status for 90 nanometer (nm) process.
With more than 230 product designs taped out to its 0.13-micron processes and more than 100,000 0.13-micron wafers shipped to date, TSMC leads the industry in advanced technology volume production. Furthermore, TSMC's 0.13-micron low-k process technology is the first in the foundry industry to pass customer product qualifications and enter volume production.
On the 90-nm front, TSMC has recorded more than twenty customer projects that are at various design stages. Production for customers using TSMC's Nexsys(SM) 90-nm technology with copper and low-k dielectrics on more cost-competitive 300mm wafers is expected to start in the third quarter of 2003.
"The successful ramp of our 0.13-micron process technology for use by customers in a wide variety of market segments, and the recent availability of our Nexsys(SM) 90-nm process, are examples of realizing TSMC's vision: 'To be the most advanced, innovative and largest provider of foundry services, and in partnership with our customers, to forge a most powerful force in the semiconductor industry,'"...