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The effects of underfill on the reliability of flip chip solder joints
The effects of underfill on the reliability of flip chip solder jointsSu, Peng; Rzepka, Sven; Korhonen, Matt; Li, C Y.
Journal of Electronic Materials; Warrendale Vol. 28, Iss. 9, (Sep 1999): 1017.
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Title
The effects of underfill on the reliability of flip chip solder joints
Author
Su, Peng; Rzepka, Sven; Korhonen, Matt; Li, C Y
Pages
1017
Publication year
1999
Publication date
Sep 1999
ISSN
0361-5235
e-ISSN
1543-186X
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
204863388
Copyright
Copyright Minerals, Metals & Materials Society Sep 1999





