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Abstract
The barrier layer for an Aluminum Gallium Nitride (AlGaN) High Electron Mobility Transistor (HEMT) on silicon is studied. The objective is to optimize the high frequency performance with a practical fabrication process. Devices with standard barrier layers and step-barrier structures are simulated and analysed using Sentaurus Technology Computer Aided Design (TCAD) and correlated with experimental results. An AlGaN HEMT with an optimized step-barrier structure can attain a unity current gain frequency of ft = 52 GHz, a 21% increase when compared to the standard device. Based on trends in the unity current gain frequency, a method for determining the critical thickness of the step-barrier is proposed.





