Abstract

Inorganic semiconductor α-Ag2S exhibits a metal-like ductile behavior at room temperature, but the origin of this high ductility has not been fully explored yet. Based on density function theory simulations on the intrinsic mechanical properties of α-Ag2S, its underlying ductile mechanism is attributed to the following three factors: (i) the low ideal shear strength and multiple slip pathways under pressure, (ii) easy movement of Ag–S octagon framework without breaking Ag−S bonds, and (iii) a metallic Ag−Ag bond forms which suppresses the Ag–S frameworks from slipping and holds them together. The easy slip pathways (or easy rearrangement of atoms without breaking bonds) in α-Ag2S provide insight into the understanding of the plastic deformation mechanism of ductile semiconductor materials, which is beneficial for devising and developing flexible semiconductor materials and electronic devices.

Details

Title
Ductile deformation mechanism in semiconductor α-Ag2S
Author
Li, Guodong 1 ; An, Qi 2 ; Morozov, Sergey I 3   VIAFID ORCID Logo  ; Duan, Bo 4 ; Goddard, William A, III 5   VIAFID ORCID Logo  ; Zhang, Qingjie 4 ; Zhai, Pengcheng 4 ; Snyder, G Jeffrey 6   VIAFID ORCID Logo 

 State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan, China; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA 
 Department of Chemical and Materials Engineering, University of Nevada Reno, Reno, NV, USA 
 Department of Computer Simulation and Nanotechnology, South Ural State University, Chelyabinsk, Russia 
 State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan, China 
 Materials and Process Simulation Center, California Institute of Technology, Pasadena, CA, USA 
 Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA 
Pages
1-6
Publication year
2018
Publication date
Aug 2018
Publisher
Nature Publishing Group
e-ISSN
20573960
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2088040749
Copyright
© 2018. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.