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Copyright © 2019 Donglu Shi et al. This is an open access article distributed under the Creative Commons Attribution License (the “License”), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. http://creativecommons.org/licenses/by/4.0/

Abstract

Not only do these materials enhance the overall performance of new building construction but also promise safer structures, longer durability of building elements, efficient building energy savings, greater environmental sustainability, and even higher indoor user comfort. The main aim of this special issue is to encapsulate the current interest and state of research related to the smart materials in building and construction applications, underpinning current and future challenges in building energy, environmental sustainability, and structural safety and durability. In this special issue, after rigorous peer-review processes, the original research papers and review papers accepted cover a wide range of topics that address the critical issues in the development and implementation of smart materials for building design and construction.

Details

Title
Smart Building and Construction Materials
Author
Shi, Donglu 1   VIAFID ORCID Logo  ; Wang, Julian 2   VIAFID ORCID Logo  ; Deng, Wen 3   VIAFID ORCID Logo 

 The Materials Science and Engineering Program, Department of Mechanical and Materials Engineering, College of Engineering and Applied Science, University of Cincinnati, Cincinnati 45221-0072, USA 
 Department of Civil and Architectural Engineering and Construction Management, University of Cincinnati, Cincinnati, OH 45221, USA; School of Architecture and Interior Design, University of Cincinnati, Cincinnati, OH 45221, USA 
 Department of Civil, Architectural and Environmental Engineering, Missouri University of Science and Technology, Rolla, MO 65409, USA 
Publication year
2019
Publication date
2019
Publisher
John Wiley & Sons, Inc.
ISSN
16878434
e-ISSN
16878442
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2168847843
Copyright
Copyright © 2019 Donglu Shi et al. This is an open access article distributed under the Creative Commons Attribution License (the “License”), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. http://creativecommons.org/licenses/by/4.0/