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Abstract
This paper discusses the optimal parameters using the Taguchi method, but also analyses the Weibull modulus through reliability engineering for polishing ceramic gauge blocks. The optimal polishing parameters for removal rate thus obtained include highest speed, greatest load and a diamond particle size of 3 μm and 30% concentration. The analysis of variance shows that the most significant polishing parameters for removal rate are speed (39.8%) and load (39.2%), followed by concentration (17.9%) and diamond size (3.1%). The optimal polishing parameters for the Weibull modulus are found to be low speed and medium or high load, regardless of diamond size and concentration.
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1 Department of Mechanical Manufacturing Engineering, National Hu-Wei Institute of Technology, Hu-Wei, Taiwan, ROC





