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Full Density Cu-Invar Composites with High Thermal Conductivity and Low Coefficient of Thermal Expansion Fabricated by Ultrasonic Powder Consolidation
Full Density Cu-Invar Composites with High Thermal Conductivity and Low Coefficient of Thermal Expansion Fabricated by Ultrasonic Powder ConsolidationWang, Ying.
Northeastern University ProQuest Dissertations & Theses, 2020. 28091671.





