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Abstract
Dielectric materials with good thermal transport performance and desirable dielectric properties have significant potential to address the critical challenges of heat dissipation for microelectronic devices and power equipment under high electric field. This work reported the role of synergistic effect and interface on through-plane thermal conductivity and dielectric properties by intercalating the hybrid fillers of the alumina and boron nitride nanosheets (BNNs) into epoxy resin. For instance, epoxy composite with hybrid fillers at a relatively low loading shows an increase of around 3 times in through-plane thermal conductivity and maintains a close dielectric breakdown strength compared to pure epoxy. Meanwhile, the epoxy composite shows extremely low dielectric loss of 0.0024 at room temperature and 0.022 at 100 ℃ and 10−1 Hz. And covalent bonding and hydrogen-bond interaction models were presented for analyzing the thermal conductivity and dielectric properties.
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Details
1 Xi’an University of Architecture and Technology, School of Mechanical and Electrical Engineering, Xi’an, China (GRID:grid.440704.3) (ISNI:0000 0000 9796 4826); Xi’an Jiaotong University, State Key Laboratory of Electrical Insulation and Power Equipment, Center of Nanomaterials for Renewable Energy, Xi’an, China (GRID:grid.43169.39) (ISNI:0000 0001 0599 1243); Shaanxi Key Laboratory of Nano Materials and Technology, Xi’an, China (GRID:grid.43169.39)
2 Xi’an Jiaotong University, State Key Laboratory of Electrical Insulation and Power Equipment, Center of Nanomaterials for Renewable Energy, Xi’an, China (GRID:grid.43169.39) (ISNI:0000 0001 0599 1243)
3 Xi’an University of Architecture and Technology, School of Mechanical and Electrical Engineering, Xi’an, China (GRID:grid.440704.3) (ISNI:0000 0000 9796 4826); Shaanxi Key Laboratory of Nano Materials and Technology, Xi’an, China (GRID:grid.440704.3)
4 Qingdao University, State Key Laboratory of Bio-Fibers and Eco-Textiles, Institute of Materials for Energy and Environment, College of Materials Science and Engineering, Qingdao, China (GRID:grid.410645.2) (ISNI:0000 0001 0455 0905)