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Abstract
Semiconductors are the basis of many vital technologies such as electronics, computing, communications, optoelectronics, and sensing. Modern semiconductor technology can trace its origins to the invention of the point contact transistor in 1947. This demonstration paved the way for the development of discrete and integrated semiconductor devices and circuits that has helped to build a modern society where semiconductors are ubiquitous components of everyday life. A key property that determines the semiconductor electrical and optical properties is the bandgap. Beyond graphene, recently discovered two-dimensional (2D) materials possess semiconducting bandgaps ranging from the terahertz and mid-infrared in bilayer graphene and black phosphorus, visible in transition metal dichalcogenides, to the ultraviolet in hexagonal boron nitride. In particular, these 2D materials were demonstrated to exhibit highly tunable bandgaps, achieved via the control of layers number, heterostructuring, strain engineering, chemical doping, alloying, intercalation, substrate engineering, as well as an external electric field. We provide a review of the basic physical principles of these various techniques on the engineering of quasi-particle and optical bandgaps, their bandgap tunability, potentials and limitations in practical realization in future 2D device technologies.
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1 Universidade Federal do Ceará, Departamento de Física, Fortaleza, Brazil (GRID:grid.8395.7) (ISNI:0000 0001 2160 0329)
2 University of Minnesota, Department of Electrical and Computer Engineering, Minneapolis, USA (GRID:grid.17635.36) (ISNI:0000000419368657)
3 University of Minnesota, Department of Electrical and Computer Engineering, Minneapolis, USA (GRID:grid.17635.36) (ISNI:0000000419368657); King Abdulaziz City for Science and Technology (KACST), Riyadh, Kingdom of Saudi Arabia (GRID:grid.452562.2) (ISNI:0000 0000 8808 6435)
4 Instituto de Ciencia de Materiales de Madrid (ICMM-CSIC), Campus de Cantoblanco, Materials Science Factory, Madrid, Spain (GRID:grid.5515.4) (ISNI:0000000119578126)
5 Instituto Tecnológico de Aeronáutica, DCTA, Department of Physics, São José dos Campos, Brazil (GRID:grid.5515.4)
6 Institute for Basic Science (IBS), Center for Integrated Nanostructure Physics, Suwon, Republic of Korea (GRID:grid.410720.0) (ISNI:0000 0004 1784 4496); Sookmyung Women’s University, Department of Electronics Engineering, Seoul, Republic of Korea (GRID:grid.412670.6) (ISNI:0000 0001 0729 3748)
7 Kyung Hee University, Department of Physics, Seoul, Republic of Korea (GRID:grid.289247.2) (ISNI:0000 0001 2171 7818)
8 Collaborative Innovation Center of Advanced Microstructures, School of Electronic Science and Engineering, Nanjing University, National Laboratory of Solid State Microstructures, Nanjing, China (GRID:grid.41156.37) (ISNI:0000 0001 2314 964X); University of California, Department of Chemistry and Biochemistry and, Los Angeles, USA (GRID:grid.19006.3e) (ISNI:0000 0000 9632 6718)
9 Nanyang Technological University, School of Materials Science and Engineering, Singapore, Singapore (GRID:grid.59025.3b) (ISNI:0000 0001 2224 0361)
10 University of Antwerp, Department of Physics, Antwerpen, Belgium (GRID:grid.5284.b) (ISNI:0000 0001 0790 3681)
11 University of Notre Dame, Department of Electrical Engineering, Notre Dame, USA (GRID:grid.131063.6) (ISNI:0000 0001 2168 0066)
12 Purdue University, School of Electrical and Computer Engineering and Birck Nanotechnology Center, West Lafayette, USA (GRID:grid.169077.e) (ISNI:0000 0004 1937 2197)
13 Institute for Basic Science (IBS), Center for Integrated Nanostructure Physics, Suwon, Republic of Korea (GRID:grid.410720.0) (ISNI:0000 0004 1784 4496); Sungkyunkwan University (SKKU), Department of Energy Science, Suwon, Republic of Korea (GRID:grid.264381.a) (ISNI:0000 0001 2181 989X)
14 IBM Thomas J. Watson Research Center, Yorktown Heights, USA (GRID:grid.481554.9)
15 Collaborative Innovation Center of Advanced Microstructures, School of Electronic Science and Engineering, Nanjing University, National Laboratory of Solid State Microstructures, Nanjing, China (GRID:grid.41156.37) (ISNI:0000 0001 2314 964X)