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© 2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

The corrugated board packaging industry is increasingly using advanced numerical tools to design and estimate the load capacity of its products. This is why numerical analyses are becoming a common standard in this branch of manufacturing. Such trends cause either the use of advanced computational models that take into account the full 3D geometry of the flat and wavy layers of corrugated board, or the use of homogenization techniques to simplify the numerical model. The article presents theoretical considerations that extend the numerical homogenization technique already presented in our previous work. The proposed here homogenization procedure also takes into account the creasing and/or perforation of corrugated board (i.e., processes that undoubtedly weaken the stiffness and strength of the corrugated board locally). However, it is not always easy to estimate how exactly these processes affect the bending or torsional stiffness. What is known for sure is that the degradation of stiffness depends, among other things, on the type of cut, its shape, the depth of creasing as well as their position or direction in relation to the corrugation direction. The method proposed here can be successfully applied to model smeared degradation in a finite element or to define degraded interface stiffnesses on a crease line or a perforation line.

Details

Title
Numerical Homogenization of Multi-Layered Corrugated Cardboard with Creasing or Perforation
Author
Garbowski, Tomasz 1   VIAFID ORCID Logo  ; Knitter-Piątkowska, Anna 2   VIAFID ORCID Logo  ; Mrówczyński, Damian 3   VIAFID ORCID Logo 

 Department of Biosystems Engineering, Poznan University of Life Sciences, Wojska Polskiego 50, 60-627 Poznań, Poland; [email protected] 
 Institute of Structural Analysis, Poznan University of Technology, Piotrowo 5, 60-965 Poznań, Poland 
 Research and Development Department, Femat Sp. z o. o., Romana Maya 1, 61-371 Poznań, Poland; [email protected] 
First page
3786
Publication year
2021
Publication date
2021
Publisher
MDPI AG
e-ISSN
19961944
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2554605454
Copyright
© 2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.