Abstract

As an important method to measure the reliability of electronic products, thermal simulation is widely used in product life prediction and reliability optimization. In this paper, the relationship between the working temperature and working performance of power components and the importance of thermal simulation analysis are discussed. The basic theory of thermal analysis software Flotherm is expounded. The functional characteristics and application range of Flotherm software are introduced. The chassis power device is designed. The boundary condition setting, grid setting, and result processing of the simulation model are introduced in detail. The results illustrate that the maximum temperature of the power components can be guaranteed within the specified temperature range, which satisfies the temperature requirements for reliable operation.

Details

Title
Simulation of Heat Dissipation in a Closed Enclosure Based On Flotherm
Author
Que, Weibo 1 ; Zhang, Qiang 1 ; Zeng, Dehuai 1 ; Wang, Chenxue 2 

 Laboratory of Optical and Electrical Engineering Technology, Shenzhen University, Guangdong 518060, PR China 
 Shenzhen Key Laboratory of Advanced Manufacturing Technology for Mold &Die, Shenzhen University, Shenzhen 518060, Guangdong, PR China 
Publication year
2019
Publication date
Apr 2019
Publisher
IOP Publishing
ISSN
17551307
e-ISSN
17551315
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2557646532
Copyright
© 2019. This work is published under http://creativecommons.org/licenses/by/3.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.