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© 2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

Voids are common defects in 3D woven composites because of the complicated manufacturing processes of the composites. In this study, a micro–meso multiscale analysis was conducted to evaluate the influence of voids on the mechanical properties of three-dimensional orthogonal woven composites. Statistical analysis was implemented to calculate the outputs of models under the different scales. A method is proposed to generate the reasonable mechanical properties of the microscale models considering randomly distributed voids and fiber filaments. The distributions of the generated properties agree well with the calculated results. These properties were utilized as inputs for the mesoscale models, in which void defects were also considered. The effects of these defects were calculated and investigated. The results indicate that tensile and shear strengths were more sensitive to the microscale voids, while the compressive strength was more influenced by mesoscale voids. The results of this study can provide a design basis for evaluating the quality of 3D woven composites with void defects.

Details

Title
Multiscale Analysis of Mechanical Properties of 3D Orthogonal Woven Composites with Randomly Distributed Voids
Author
Gong, Yaohua 1   VIAFID ORCID Logo  ; Huang, Tao 1 ; Xun’an Zhang 1 ; Suo, Yongyong 1 ; Jia, Purong 1 ; Zhao, Shuyi 2 

 School of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, Xi’an 710129, China; [email protected] (Y.G.); [email protected] (X.Z.); [email protected] (Y.S.); [email protected] (P.J.) 
 Department of System Engineering and Integration, AECC Commercial Aircraft Engine Co., LTD., Shanghai 201100, China; [email protected] 
First page
5247
Publication year
2021
Publication date
2021
Publisher
MDPI AG
e-ISSN
19961944
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2576459454
Copyright
© 2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.