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© 2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

Managing the timing constraints has become an important factor in the physical design of multiple supply voltage (MSV) integrated circuits (IC). Clock distribution and module scheduling are some of the conventional methods used to satisfy the timing constraints of a chip. In this paper, we propose a simulated annealing-based MSV floorplanning methodology for the design of ICs within the timing budget. Additionally, we propose a modified SKB tree representation for floorplanning the modules in the design. Our algorithm finds the optimal dimensions and position of the clocked modules in the design to reduce the wirelength and satisfy the timing constraints. The proposed algorithm is implemented in IWLS 2005 benchmark circuits and considers power, wirelength, and timing as the optimization parameters. Simulation results were obtained from the Cadence Innovus digital system taped-out at 45 nm. Our simulation results show that the proposed algorithm satisfies timing constraints through a 30.6% reduction in wirelength.

Details

Title
An Investigation of Clock Skew Using a Wirelength-Aware Floorplanning Process in the Pre-Placement Stages of MSV Layouts
Author
Srinath, B 1 ; Verma, Rajesh 2 ; Abdulwasa Bakr Barnawi 2 ; Ramkumar Raja 2 ; Mohammed Abdul Muqeet 2 ; Shukla, Neeraj Kumar 2   VIAFID ORCID Logo  ; A Ananthi Christy 3 ; Bharatiraja, C 4   VIAFID ORCID Logo  ; Josiah Lange Munda 5   VIAFID ORCID Logo 

 Consultant, MissionX Pvt, Mahindra 603002, India; [email protected] 
 Department of Electrical Engineering, College of Engineering, King Khalid University, Abha, Asir 61411, Saudi Arabia; [email protected] (R.V.); [email protected] (A.B.B.); [email protected] (R.R.); [email protected] (M.A.M.); [email protected] (N.K.S.) 
 Department of Electrical and Electronics Engineeqring, Saveetha School of Engineering, SIMATS Saveetha University, Chennai 600077, India; [email protected] 
 Department of Electrical and Electronics Engineering, SRM Institute of Science and Technology, Chennai 603203, India 
 Department of Electrical Engineering, Tshwane University of Technology, Pretoria 0001, South Africa; [email protected] 
First page
2795
Publication year
2021
Publication date
2021
Publisher
MDPI AG
e-ISSN
20799292
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2602042474
Copyright
© 2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.