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© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

This study proposes a rapid and inexpensive thermocycler that enables rapid heating of samples using a thin glass chip and a cheap chip resistor to overcome the on-site diagnostic limitations of polymerase chain reaction (PCR). Microchip PCR devices have emerged to miniaturize conventional PCR systems and reduce operation time and cost. In general, PCR microchips require a thin-film heater fabricated through a semiconductor process, which is a complicated process, resulting in high costs. Therefore, this investigation substituted a general chip resistor for a thin-film heater. The proposed thermocycler consists of a compact glass microchip of 12.5 mm × 12.5 mm × 2 mm that could hold a 2 μL PCR sample and a surface-mounted chip resistor of 6432 size (6.4 mm × 3.2 mm). Improving heat transfer from the chip resistor heater to the PCR reaction chamber in the microchip was accomplished via the design and fabrication of a three-dimensional chip structure using selective laser-induced etching, a rapid prototyping technique that allowed to be embedded. The fabricated PCR microchip was combined with a thermistor temperature sensor, a blower fan, and a microcontroller. The assembled thermocycler could heat the sample at a maximum rate of 28.8 °C/s per second. When compared with a commercially available PCR apparatus running the same PCR protocol, the total PCR operating time with a DNA sample was reduced by about 20%.

Details

Title
A Thermocycler Using a Chip Resistor Heater and a Glass Microchip for a Portable and Rapid Microchip-Based PCR Device
Author
Yeom, Dongsun 1   VIAFID ORCID Logo  ; Kim, Jeongtae 1 ; Kim, Sungil 2   VIAFID ORCID Logo  ; Ahn, Sanghoon 2   VIAFID ORCID Logo  ; Choi, Jiyeon 2   VIAFID ORCID Logo  ; Kim, Youngwook 3 ; Koo, Chiwan 1   VIAFID ORCID Logo 

 Department of Electronic Engineering, Hanbat National University, Daejeon 34158, Korea; [email protected] (D.Y.); [email protected] (J.K.) 
 Department of Laser and Electron Beam Application, Korea Institute of Machinery and Materials, Daejeon 34103, Korea; [email protected] (S.K.); [email protected] (S.A.); [email protected] (J.C.) 
 Department of Electronic Engineering, Sogang University, Seoul 04107, Korea; [email protected] 
First page
339
Publication year
2022
Publication date
2022
Publisher
MDPI AG
e-ISSN
2072666X
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2632994999
Copyright
© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.