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© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

Three-dimensional microstructures play a key role in the fabrication of flexible electronic products. However, the development of flexible electronics is limited in further applications due to low positioning accuracy, the complex process, and low production efficiency. In this study, a novel method for fabricating three-dimensional circular truncated cone microstructures via low-frequency ultrasonic resonance printing is proposed. Simultaneously, to simplify the manufacturing process of flexible sensors, the microstructure and printed interdigital electrodes were fabricated into an integrated structure, and a flexible pressure sensor with microstructures was fabricated. Additionally, the effects of flexible pressure sensors with and without microstructures on performance were studied. The results show that the overall performance of the designed sensor with microstructures could be effectively improved by 69%. Moreover, the sensitivity of the flexible pressure sensor with microstructures was 0.042 kPa−1 in the working range of pressure from 2.5 to 10 kPa, and the sensitivity was as low as 0.013 kPa−1 within the pressure range of 10 to 30 kPa. Meanwhile, the sensor showed a fast response time, which was 112 ms. The stability remained good after the 100 cycles of testing. The performance was better than that of the flexible sensor fabricated by the traditional inverted mold method. This lays a foundation for the development of flexible electronic technology in the future.

Details

Title
Effects of Three-Dimensional Circular Truncated Cone Microstructures on the Performance of Flexible Pressure Sensors
Author
Jin, Weikan 1 ; Yu, Zhiheng 2   VIAFID ORCID Logo  ; Hu, Guohong 3 ; Zhang, Hui 3 ; Huang, Fengli 3   VIAFID ORCID Logo  ; Gu, Jinmei 3 

 School of Mechanical Engineering and Automation, Zhejiang Sci-Tech University, Hangzhou 310018, China; [email protected]; Key Laboratory of Advanced Manufacturing Technology of Jiaxing City, Jiaxing University, Jiaxing 341000, China; [email protected] (G.H.); [email protected] (J.G.) 
 College of Mechanical and Electrical Engineering, Jiaxing Nanhu University, Jiaxing 314000, China; [email protected] 
 Key Laboratory of Advanced Manufacturing Technology of Jiaxing City, Jiaxing University, Jiaxing 341000, China; [email protected] (G.H.); [email protected] (J.G.) 
First page
4708
Publication year
2022
Publication date
2022
Publisher
MDPI AG
e-ISSN
19961944
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2686075546
Copyright
© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.