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Abstract

Realizing increasingly complex artificial intelligence (AI) functionalities directly on edge devices calls for unprecedented energy efficiency of edge hardware. Compute-in-memory (CIM) based on resistive random-access memory (RRAM) promises to meet such demand by storing AI model weights in dense, analogue and non-volatile RRAM devices, and by performing AI computation directly within RRAM, thus eliminating power-hungry data movement between separate compute and memory. Although recent studies have demonstrated in-memory matrix-vector multiplication on fully integrated RRAM-CIM hardware, it remains a goal for a RRAM-CIM chip to simultaneously deliver high energy efficiency, versatility to support diverse models and software-comparable accuracy. Although efficiency, versatility and accuracy are all indispensable for broad adoption of the technology, the inter-related trade-offs among them cannot be addressed by isolated improvements on any single abstraction level of the design. Here, by co-optimizing across all hierarchies of the design from algorithms and architecture to circuits and devices, we present NeuRRAM-a RRAM-based CIM chip that simultaneously delivers versatility in reconfiguring CIM cores for diverse model architectures, energy efficiency that is two-times better than previous state-of-the-art RRAM-CIM chips across various computational bit-precisions, and inference accuracy comparable to software models quantized to four-bit weights across various AI tasks, including accuracy of 99.0 percent on MNIST and 85.7 percent on CIFAR-10 image classification, 84.7-percent accuracy on Google speech command recognition, and a 70-percent reduction in image-reconstruction error on a Bayesian image-recovery task.

Details

Title
A compute-in-memory chip based on resistive random-access memory
Author
Wan, Weier 1 ; Kubendran, Rajkumar 2 ; Schaefer, Clemens 3 ; Eryilmaz, Sukru Burc 1 ; Zhang, Wenqiang 4 ; Wu, Dabin; Deiss, Stephen; Raina, Priyanka; Qian, He; Gao, Bin; Joshi, Siddharth; Wu, Huaqiang; Wong, H-S Philip; Cauwenberghs, Gert

 Stanford University, Stanford, CA, USA 
 University of California San Diego, La Jolla, CA, USA 
 University of Notre Dame, Notre Dame, IN, USA 
 Tsinghua University, Beijing, China 
Pages
504-512,512A-512T
Section
Article
Publication year
2022
Publication date
Aug 18, 2022
Publisher
Nature Publishing Group
ISSN
00280836
e-ISSN
14764687
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2705455305
Copyright
Copyright Nature Publishing Group Aug 18, 2022