INTERNATIONAL PATENT: TOKYO ELECTRON LIMITED FILES APPLICATION FOR "DATA COLLECTION SYSTEM, DATA COLLECTION DEVICE, DATA COLLECTION METHOD AND DATA COLLECTION PROGRAM"

GENEVA, Sept. 13 -- TOKYO ELECTRON LIMITED (3-1 Akasaka 5-chome, Minato-ku, Tokyo1076325) filed a patent application (PCT/JP2022/006954) for "DATA COLLECTION SYSTEM, DATA COLLECTION DEVICE, DATA COLLECTION METHOD, AND DATA COLLECTION PROGRAM" on Feb 21, 2022. With publication no. WO/2022/185969, the details related to the patent application was published on Sep 09, 2022.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MORIYA, Tsuyoshi (c/o Tokyo Electron Limited, Akasaka Biz Tower, 3-1 Akasaka 5-chome, Minato-ku, Tokyo1076325), MOKI, Hironori (c/o Tokyo Electron Miyagi Limited, 1 Techno Hills, Taiwa-cho, Kurokawa-gun, Miyagi9813629), UOYAMA, Kazuya (c/o Tokyo Electron Limited, 10F, Daido Seimei Sapporo Building, 1, Kita 3-jo, Nishi 3-chome, Chuo-ku, Sapporo City, Hokkaido0600003), MATSUZAWA, Takahito (c/o Tokyo Electron Limited, 10F, Daido Seimei Sapporo Building, 1, Kita 3-jo, Nishi 3-chome, Chuo-ku, Sapporo City, Hokkaido0600003), KATAOKA, Yuki (c/o Tokyo Electron Limited, 10F, Daido Seimei Sapporo Building, 1, Kita 3-jo, Nishi 3-chome, Chuo-ku, Sapporo City, Hokkaido0600003)

Abstract:

The present invention collects appropriate data for investigating processing conditions during substrate processing. A data collection system comprising a first substrate processing device that has a first processing space, a second substrate processing device that has a second processing space, and a data collection device that is connected to the first substrate processing device and the second substrate processing device, said data collection system further comprising: a correction amount calculation unit that compares observation data observed during the processing of substrates that have the same or similar shapes under the same processing conditions in each of the first processing space and the second processing space, and calculates a correction amount for correcting the observation data observed during the processing in the second processing space; and a collection unit that, when searching for processing conditions by processing a substrate in the second processing space under altered processing conditions, corrects the observation data observed during the processing in the second processing space on the basis of the correction amount and collects the corrected observation data.

For more information:https://patentscope.wipo.int/search/en/detail.jsf?docId=WO2022185969