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© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

Microchannel heat sink (MCHS) is a promising solution for removing the excess heat from an electronic component such as a microprocessor, electronic chip, etc. In order to increase the heat removal rate, the design of MCHS plays a vital role, and can avoid damaging heat-sensitive components. Therefore, the passage of the MCHS has been designed with a periodic right triangular groove in the flow passage. The motivation for this form of groove shape is taken from heat transfer enhancement techniques used in solar air heaters. In this paper, a numerical study of this new design of microchannel passage is presented. The microchannel design has five variable groove angles, ranging from 15° to 75°. Computational fluid dynamics (CFD) is used to simulate this unique microchannel. Based on the Navier–Stokes and energy equations, a 3D model of the microchannel heat sink was built, discretized, and laminar numerical solutions for heat transfer, pressure drop, and thermohydraulic performance were derived. It was found that Nusselt number and thermo-hydraulic performance are superior in the microchannel with a 15° groove angle. In addition, thermohydraulic performance parameters (THPP) were evaluated and discussed. THPP values were found to be more than unity for a designed microchannel that had all angles except 75°, which confirm that the proposed design of the microchannel is a viable solution for thermal management.

Details

Title
Analysis of Microchannel Heat Sink of Silicon Material with Right Triangular Groove on Sidewall of Passage
Author
Saha, Surojit 1 ; Alam, Tabish 2 ; Md Irfanul Haque Siddiqui 3   VIAFID ORCID Logo  ; Kumar, Mukesh 1 ; Masood, Ashraf Ali 4   VIAFID ORCID Logo  ; Gupta, Naveen Kumar 5 ; Dobrotă, Dan 6   VIAFID ORCID Logo 

 Department of Mechanical Engineering, Indian Institute of Engineering Science and Technology, Howrah 711103, India 
 CSIR—Central Building Research Institute, Roorkee 247667, India 
 Mechanical Engineering Department, King Saud University, Riyadh 11421, Saudi Arabia 
 Department of Industrial Engineering, College of Engineering, Prince Sattam Bin Abdulaziz University, Al-Kharj 16273, Saudi Arabia 
 Institute of Engineering and Technology, GLA University, Mathura 281406, India 
 Department of Industrial Engineering and Management, Faculty of Engineering, Lucian Blaga University of Sibiu, 550024 Sibiu, Romania 
First page
7020
Publication year
2022
Publication date
2022
Publisher
MDPI AG
e-ISSN
19961944
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2724271882
Copyright
© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.