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© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

In the field of soft electronics, high-resolution and transparent structures based on various flexible materials constructed via various printing techniques are gaining attention. With the support of electrical stress-induced conductive inks, the electrohydrodynamic (EHD) jet printing technique enables us to build high-resolution structures compared with conventional inkjet printing techniques. Here, EHD jet printing was used to fabricate a high-resolution, transparent, and flexible strain sensor using a polydimethylsiloxane (PDMS)/xylene elastomer, where repetitive and controllable high-resolution printed mesh structures were obtained. The parametric effects of voltage, flow rate, nozzle distance from the substrate, and speed were experimentally investigated to achieve a high-resolution (5 µm) printed mesh structure. Plasma treatment was performed to enhance the adhesion between the AgNWs and the elastomer structure. The plasma-treated functional structure exhibited stable and long strain-sensing cycles during stretching and bending. This simple printing technique resulted in high-resolution, transparent, flexible, and stable strain sensing. The gauge factor of the strain sensor was significantly increased, owing to the high resolution and sensitivity of the printed mesh structures, demonstrating that EHD technology can be applied to high-resolution microchannels, 3D printing, and electronic devices.

Details

Title
High-Resolution, Transparent, and Flexible Printing of Polydimethylsiloxane via Electrohydrodynamic Jet Printing for Conductive Electronic Device Applications
Author
Rizwan Ul Hassan 1   VIAFID ORCID Logo  ; Shaheer Mohiuddin Khalil 1 ; Saeed Ahmed Khan 2   VIAFID ORCID Logo  ; Shahzaib Ali 1 ; Moon, Joonkyeong 1 ; Dae-Hyun Cho 3   VIAFID ORCID Logo  ; Byun, Doyoung 1 

 Department of Mechanical Engineering, Sungkyunkwan University, Suwon 16419, Korea 
 Department of Mechanical Engineering, Sungkyunkwan University, Suwon 16419, Korea; Department of Electrical Engineering, Sukkur IBA University, Sukkur 79165, Pakistan 
 Department of Mechatronics Engineering, Gyeongsang National University, Jinju 52725, Korea; Department of Energy System Engineering, Gyeongsang National University, 33 Dongjin-ro, Jinju 52828, Korea 
First page
4373
Publication year
2022
Publication date
2022
Publisher
MDPI AG
e-ISSN
20734360
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2728524820
Copyright
© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.