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© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

At present, composite solder pastes are getting a lot of attention, especially composite Sn based solders reinforced by nanoparticles. Indeed, CoSn3 is a strong nucleating agent of Sn crystal, which has potential application value in the field of electronic packaging. However, there is no reliable synthetic path for CoSn3 nanoparticles at present. In this article, a chemical synthesis method for CoSn3 nanoparticles is developed. Here, CoCl2 and SnCl2 are reduced by NaHB4 in triethylene glycol (TEG), dispersed by ultrasonics, and heated to 350 °C in a tube furnace for growth. The CoSn3 nanoparticles with a diameter of about 150 nm are obtained by heating at 350 °C for 10 min. The CoSn3 nanoparticles undergo a step reaction in the process of synthesis and go through different stages of merging and annexation during their growth. The crystal growth behavior and the process of orientation change during the nucleation and growth of CoSn3 nanoparticles are studied, especially the two growth mechanisms, namely OU (orientation unified) and OA (orientation attached). By mixing CoSn3 nanoparticles with SAC305, we obtain a kind of strengthened composite soldering paste. There are obvious six-fold cyclic twins in the joints made by this soldering paste.

Details

Title
CoSn3 Intermetallic Nanoparticles for Electronic Packaging
Author
Wang, Jintao 1 ; Lv, Ziwen 1 ; Zhang, Luobin 1 ; Duan, Fangcheng 1 ; Zhang, Weiwei 1 ; Chen, Hongtao 1 

 Department of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China; State Key Lab of Advanced Solder Ang Joining, Harbin Institute of Technology, Harbin 150001, China; Sauvage Laboratory for Smart Materials, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China 
First page
4083
Publication year
2022
Publication date
2022
Publisher
MDPI AG
e-ISSN
20794991
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2739449097
Copyright
© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.