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© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

The digital image correlation (DIC) method is widely used in deformation measurements as it has the advantages of being a non-contact, high precision method that provides full field measurements, and requires simple experimental equipment. Traditionally, the grayscale speckle patterns captured by a monochromatic camera are used in the DIC method. With the growing development of consumer color cameras, there is great potential for developing color information in the DIC method. This paper proposes a displacement- and stress–strain-invariant DIC deformation measurement method based on the integer-pixel matching approach for speckle patterns during a tension test. For the integer-pixel matching stage, the load and displacement and stress–strain-invariant histories feature is used to estimate the initial value of the deformation parameters. In addition, this paper proposes a reverse retrieve strategy, instead of a forward search, to reduce the search time. Experiments show that the proposed DIC deformation measurement approach is not only capable of displacement invariance measurement, with robustness and high efficiency, but also that the average accuracy of the stress–strain result can reach 0.1%.

Details

Title
Deformation Measurement of a SS304 Stainless Steel Sheet Using Digital Image Correlation Method
Author
Jain, Appurva 1 ; Mishra, Abhishek 1 ; Tiwari, Vikrant 2 ; Singh, Gurminder 3   VIAFID ORCID Logo  ; Ravinder Pal Singh 4 ; Singh, Sunpreet 5   VIAFID ORCID Logo 

 Department of Mechanical Engineering, National Institute of Technology Delhi, New Delhi 110036, India 
 Department of Applied Mechanics, Indian Institute of Technology Delhi, New Delhi 110016, India 
 Department of Mechanical Engineering, Indian Institute of Technology Bombay, Mumbai 400076, India 
 Department of Mechanical Engineering, MMEC, Maharishi Markandeshwar (Deemed to be University), Mullana 133207, India 
 Department of Mechanical Engineering, National University of Singapore, Singapore 117549, Singapore; Department of Mechanical Engineering, Chandigarh University, Sahibzada Ajit Singh Nagar 140413, India 
First page
912
Publication year
2022
Publication date
2022
Publisher
MDPI AG
e-ISSN
23046732
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2756777497
Copyright
© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.