Content area

Abstract

Thermal management has been increasingly recognized as a limiting factor for advanced high-power electronics. Diamond can offer unique technological opportunities in the field of thermal management due to a broad range of outstanding properties, such as exceptional high thermal conductivity, high radiation hardness, unique electronic, photonic and quantum characteristics, and outstanding mechanical behavior desirable for cutting-edge electronics, optics, and extreme mechanics. Diamond films have considerable applications for heat sink and high-power chips such as high-electron-mobility transistors and quantum devices where unique electronic or quantum properties, heat transfer, and structural stability are vital. The ever-growing miniaturization of electronics and the progresses in quantum sciences all call for diamond films with desired structures and properties. This review focuses on the thermal properties of chemical vapor deposited diamond thin films, including typical processing technologies, different techniques for thermal property measurement, in-plane and cross-plane thermal properties of various diamond thin films and associated interfacial thermal conductance in addition to highlights of diamond films for thermal management and other premier applications.

Details

Title
A review of thermal properties of CVD diamond films
Author
Zhang, Chunyan 1 ; Vispute, Ratnakar D. 2 ; Fu, Kun 3 ; Ni, Chaoying 1   VIAFID ORCID Logo 

1  University of Delaware, Department of Material Science and Engineering, Newark, USA (GRID:grid.33489.35) (ISNI:0000 0001 0454 4791) 
2  Blue Wave Semiconductors, Inc, Baltimore, USA (GRID:grid.432316.1) 
3  University of Delaware, Department of Mechanical Engineering, Newark, USA (GRID:grid.33489.35) (ISNI:0000 0001 0454 4791) 
Pages
3485-3507
Publication year
2023
Publication date
Feb 2023
Publisher
Springer Nature B.V.
ISSN
00222461
e-ISSN
15734803
Source type
Scholarly Journal
Language of publication
English
DOI
https://doi.org/10.1007/s10853-023-08232-w
ProQuest document ID
2779258353
Copyright
© The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.