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© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

This paper presents a study on long-distance wireless power transfer (WPT), which formulates the voltage gain in terms of the coupling coefficient between the power transmitting unit (PTU) and the power receiving unit (PRU) coils. It is proposed that maximum power transfer efficiency (PTE) can be reached when maximum voltage gain is achieved under a matching condition between the coil quality factor and the coupling coefficient. In order to achieve maximum power delivered to load (PDL), we need to elevate the input voltage as high as the high breakdown-voltage of gallium nitride (GaN) high-electron mobility transistors (HEMT) along with class E amplifier circuit topology. In order to promote voltage gain, knowledge of the coupling coefficient between two coils including the factors of the coil diameter, wire diameter, coil turns, and the coil resistance are derived. It was observed that a lower coil resistance leads to a reduced parallel quality, which facilitates long-distance wireless power transfer. Experimental results support the findings that the maximum PTE occurred at the maximum voltage gain existing at a specific distance matches the coupling coefficient between coils. A maximum power point tracking (MPPT) method is also developed to achieve maximum PDL. At a distance of 35 cm, experiments with more than 100 W successfully receive a PTE of 57% at the PRU when the received voltage reached 1.4 kV. This is used to verify the concepts and analysis that are proposed in this paper.

Details

Title
Resonant Mechanism for a Long-Distance Wireless Power Transfer Using Class E PA and GaN HEMT
Author
Ching-Yao, Liu 1   VIAFID ORCID Logo  ; Chih-Chiang, Wu 2   VIAFID ORCID Logo  ; Li-Chuan, Tang 1   VIAFID ORCID Logo  ; Yueh-Tsung Shieh 1 ; Wei-Hua Chieng 1 ; Edward-Yi, Chang 3 

 Department of Mechanical Engineering, College of Engineering, National Yang-Ming Chiao-Tung University, Hsinchu 30010, Taiwan; [email protected] (C.-Y.L.); [email protected] (L.-C.T.); [email protected] (Y.-T.S.) 
 Mechanical and Mechatronics Systems Research Laboratories, Industrial Technology Research Institute, Hsinchu 31040, Taiwan; [email protected] 
 Department of Material Science and Engineering, College of Engineering, National Yang-Ming Chiao-Tung University, Hsinchu 30010, Taiwan; [email protected] 
First page
3657
Publication year
2023
Publication date
2023
Publisher
MDPI AG
e-ISSN
19961073
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2812438691
Copyright
© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.