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Abstract

In this paper, a flexible resistive pressure sensor of polydimethylsiloxane (PDMS) with porous pyramidal array structure is proposed to be prepared rapidly by laser etching. The porous doped PDMS was prepared by laser etching technique and continuous heat treatment to overcome the viscosity requirement of porous silica by traditional template method, reduce the preparation cost, and improve the practicality. Using the carbon-based filler material with high light absorption coefficient and low interfacial thermal resistance, the light absorption coefficient of MWCNTs has a significant role in laser etching, which has a significant effect on the depth of cut of the laser. In addition, the strain response of the porous PDMS sponge media layer under different external forces was simulated using finite element analysis (FEA). Its sensitivity is as high as 645 kPa−1, with fast response of 26 ms and 32 ms, good hysteresis (0.78%), and strong stability in 5000 cycles. The ultra-high sensitivity is the key to make the flexible pressure sensor widely use in medical detection, which can be widely applied to heartbeat detection, gesture recognition, and real-time detection in healthcare.

Details

Title
High-sensitivity porous PDMS sensor based on laser-etched pyramidal structure
Author
Zhang, Xiaodong 1 ; Pan, Peng 1   VIAFID ORCID Logo  ; Wei, Jun 2 ; Yang, Zhengchun 1 ; Liu, Jun 3 ; Li, Peng 1 ; Liu, Guanying 1 ; Shen, Haodong 1 ; Zeng, Peifeng 1 

 Tianjin University of Technology, School of Integrated Circuit Science and Engineering, Advanced Materials and Printed Electronics Center, Tianjin Key Laboratory of Film Electronic & Communication Devices, Tianjin, China (GRID:grid.265025.6) (ISNI:0000 0000 9736 3676) 
 Harbin Institute of Technology, School of Materials Science and Engineering, Shenzhen, China (GRID:grid.19373.3f) (ISNI:0000 0001 0193 3564) 
 Tianjin University of Technology, School of Electrical Engineering and Automation, Tianjin, China (GRID:grid.265025.6) (ISNI:0000 0000 9736 3676) 
Pages
1178
Publication year
2023
Publication date
May 2023
Publisher
Springer Nature B.V.
ISSN
09574522
e-ISSN
1573482X
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2815843435
Copyright
© The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.