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Abstract
The gold wire lead bonding process is a key technology to realize the electrical connection between the chip and the external control circuit to be completed. This paper introduces the basic concept of lead bonding technology and analyzes the process parameters affecting the quality of lead bonding, mainly including ultrasonic power, ultrasonic time, and bonding pressure. The orthogonal test method is used to investigate the process parameters affecting the bonding quality of 25 μm gold wire. The optimal combination of process parameters A3B2C2 is determined, i.e., the ultrasonic power value is 90 mW, the ultrasonic time is 20 ms, and the bonding pressure is 40 gf, which improves the reliability of the wire bonding process.
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Details
1 Department of Microelectronics, Shanghai University , Shanghai 200000 , China
2 Shanghai Aure Technology Limited Company , Shanghai 200000 , China
3 Department of Microelectronics, Shanghai University , Shanghai 200000 , China; Shanghai Industrial µTechnology Research Institute , Shanghai 200000 , China; Shanghai Aure Technology Limited Company , Shanghai 200000 , China