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Abstract
Heavily Si-doped GaN epitaxial layers (n+GaN) have been grown on semi-insulating 6H-SiC substrate by metal–organic chemical vapor deposition at 1030°C using H2 and N2 as carrier gases. Thin film characterization results demonstrated that n+GaN grown in N2 carrier gas has superior morphological and crystalline quality to that grown in H2. The surface morphology of n+GaN grown with N2 carrier gas is insensitive to the growth rate and SiH4 flow with Si doping concentration up to 1.1 × 1020/cm3. Secondary ion mass spectrometry analysis confirmed that C and O impurity levels in n+GaN are one order of magnitude lower with N2 carrier gas than with H2. The results thus indicate that 100% N2 could be a better carrier gas candidate to enable a broader process window for future HEMT S/D n+GaN selective area epitaxial process applications.






