INTERNATIONAL PATENT: SHANGHAI METAPWR ELECTRONICS CO., LTD, 上海沛塬电子有限公司 FILES APPLICATION FOR "HIGH-FREQUENCY HIGH-POWER PACKAGE MODULE, MANUFACTURING METHOD FOR MODULE AND HYBRID SUBSTRATE"

GENEVA, Oct. 2 -- SHANGHAI METAPWR ELECTRONICS CO., LTD (Building C, No. 888, Huanhu West 2nd Road, Lingang New Area, China (Shanghai) Pilot Free Trade Zone Lingang Special AreaPudong New Area, Shanghai 201306), 上海沛塬电子有限公司 (中国上海市浦东新区中国（上海）自由贸易试验区临港新片区环湖西二路888号C楼) filed a patent application (PCT/CN2023/082358) for "HIGH-FREQUENCY HIGH-POWER PACKAGE MODULE, MANUFACTURING METHOD FOR MODULE, AND HYBRID SUBSTRATE" on Mar 17, 2023. With publication no. WO/2023/179507, the details related to the patent application was published on Sep 28, 2023.

Notably, the patent application was submitted under the International Patent Classification...