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© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

Ultra-thin solar cells enable materials to be saved, reduce deposition time, and promote carrier collection from materials with short diffusion lengths. However, light absorption efficiency in ultra-thin solar panels remains a limiting factor. Most methods to increase light absorption in ultra-thin solar cells are either technically challenging or costly, given the thinness of the functional layers involved. We propose a cost-efficient and lithography-free solution to enhance light absorption in ultra-thin solar cells—a Tsuchime-like self-forming nanocrater (T-NC) aluminum (Al) film. T-NC Al film can be produced by the electrochemical anodization of Al, followed by etching the nanoporous alumina. Theoretical studies show that T-NC film can increase the average absorbance by 80.3%, depending on the active layer’s thickness. The wavelength range of increased absorption varies with the active layer thickness, with the peak of absolute absorbance increase moving from 620 nm to 950 nm as the active layer thickness increases from 500 nm to 10 µm. We have also shown that the absorbance increase is retained regardless of the active layer material. Therefore, T-NC Al film significantly boosts absorbance in ultra-thin solar cells without requiring expensive lithography, and regardless of the active layer material.

Details

Title
Tsuchime-like Aluminum Film to Enhance Absorption in Ultra-Thin Photovoltaic Cells
Author
Mikita Marus 1 ; Mukha, Yauhen 2   VIAFID ORCID Logo  ; Wong, Him-Ting 3 ; Tak-Lam, Chan 3 ; Smirnov, Aliaksandr 2 ; Hubarevich, Aliaksandr 2 ; Hu, Haibo 4 

 Centre for Advances in Reliability and Safety (CAiRS), Unit 1212–1213, 12/F, Building 19W, Hong Kong Science Park, Pak Shek Kok, New Territories, Hong Kong, China; [email protected] (M.M.); [email protected] (H.-T.W.); [email protected] (T.-L.C.); Laboratory for Information Display and Processing Units, Belarusian State University of Informatics and Radioelectronics, 6 P. Brovki, 220013 Minsk, Belarus; [email protected] (Y.M.); [email protected] (A.S.) 
 Laboratory for Information Display and Processing Units, Belarusian State University of Informatics and Radioelectronics, 6 P. Brovki, 220013 Minsk, Belarus; [email protected] (Y.M.); [email protected] (A.S.) 
 Centre for Advances in Reliability and Safety (CAiRS), Unit 1212–1213, 12/F, Building 19W, Hong Kong Science Park, Pak Shek Kok, New Territories, Hong Kong, China; [email protected] (M.M.); [email protected] (H.-T.W.); [email protected] (T.-L.C.) 
 Centre for Advances in Reliability and Safety (CAiRS), Unit 1212–1213, 12/F, Building 19W, Hong Kong Science Park, Pak Shek Kok, New Territories, Hong Kong, China; [email protected] (M.M.); [email protected] (H.-T.W.); [email protected] (T.-L.C.); Department of Electrical and Electronic Engineering, Hong Kong Polytechnic University, Hong Kong, China 
First page
2650
Publication year
2023
Publication date
2023
Publisher
MDPI AG
e-ISSN
20794991
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2876557888
Copyright
© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.