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Title
Microfluidic magnetic detection system combined with a DNA framework-mediated immune-sandwich assay for rapid and sensitive detection of tumor-derived exosomes
Author
Qian, Qiuling 1 ; Wei, Yutong 2 ; Xu, Yi 3 ; Zheng, Mengmeng 4 ; Wang, Chenguang 5 ; Zhang, Shulin 6 ; Xie, Xiaoming 6 ; Ye, Chaofeng 7 ; Mi, Xianqiang 8
1 Chinese Academy of Sciences, National Key Laboratory of Materials for Integrated Circuits, Shanghai Institute of Microsystem and Information Technology, Shanghai, China (GRID:grid.9227.e) (ISNI:0000000119573309); Chinese Academy of Sciences, Shanghai Advanced Research Institute, Shanghai, China (GRID:grid.9227.e) (ISNI:0000000119573309); University of Chinese Academy of Sciences, Beijing, China (GRID:grid.410726.6) (ISNI:0000 0004 1797 8419)
2 Chinese Academy of Sciences, National Key Laboratory of Materials for Integrated Circuits, Shanghai Institute of Microsystem and Information Technology, Shanghai, China (GRID:grid.9227.e) (ISNI:0000000119573309); University of Chinese Academy of Sciences, Beijing, China (GRID:grid.410726.6) (ISNI:0000 0004 1797 8419); Shanghai Tech University, School of Information Science and Technology, Shanghai, China (GRID:grid.440637.2) (ISNI:0000 0004 4657 8879)
3 Chinese Academy of Sciences, National Key Laboratory of Materials for Integrated Circuits, Shanghai Institute of Microsystem and Information Technology, Shanghai, China (GRID:grid.9227.e) (ISNI:0000000119573309); Chinese Academy of Sciences, Shanghai Advanced Research Institute, Shanghai, China (GRID:grid.9227.e) (ISNI:0000000119573309)
4 Chinese Academy of Sciences, Shanghai Advanced Research Institute, Shanghai, China (GRID:grid.9227.e) (ISNI:0000000119573309); Shanghai University, School of Life Sciences, Shanghai, China (GRID:grid.39436.3b) (ISNI:0000 0001 2323 5732)
5 Chinese Academy of Sciences, Shanghai Advanced Research Institute, Shanghai, China (GRID:grid.9227.e) (ISNI:0000000119573309); University of Chinese Academy of Sciences, Beijing, China (GRID:grid.410726.6) (ISNI:0000 0004 1797 8419)
6 Chinese Academy of Sciences, National Key Laboratory of Materials for Integrated Circuits, Shanghai Institute of Microsystem and Information Technology, Shanghai, China (GRID:grid.9227.e) (ISNI:0000000119573309)
7 Shanghai Tech University, School of Information Science and Technology, Shanghai, China (GRID:grid.440637.2) (ISNI:0000 0004 4657 8879)
8 Chinese Academy of Sciences, National Key Laboratory of Materials for Integrated Circuits, Shanghai Institute of Microsystem and Information Technology, Shanghai, China (GRID:grid.9227.e) (ISNI:0000000119573309); Chinese Academy of Sciences, Shanghai Advanced Research Institute, Shanghai, China (GRID:grid.9227.e) (ISNI:0000000119573309); University of Chinese Academy of Sciences, Beijing, China (GRID:grid.410726.6) (ISNI:0000 0004 1797 8419); University of Chinese Academy of Sciences, Chinese Academy of Sciences, School of Physics and Optoelectronic Engineering Hangzhou Institute for Advanced Study, Hangzhou, China (GRID:grid.410726.6) (ISNI:0000 0004 1797 8419)
1 Chinese Academy of Sciences, National Key Laboratory of Materials for Integrated Circuits, Shanghai Institute of Microsystem and Information Technology, Shanghai, China (GRID:grid.9227.e) (ISNI:0000000119573309); Chinese Academy of Sciences, Shanghai Advanced Research Institute, Shanghai, China (GRID:grid.9227.e) (ISNI:0000000119573309); University of Chinese Academy of Sciences, Beijing, China (GRID:grid.410726.6) (ISNI:0000 0004 1797 8419)
2 Chinese Academy of Sciences, National Key Laboratory of Materials for Integrated Circuits, Shanghai Institute of Microsystem and Information Technology, Shanghai, China (GRID:grid.9227.e) (ISNI:0000000119573309); University of Chinese Academy of Sciences, Beijing, China (GRID:grid.410726.6) (ISNI:0000 0004 1797 8419); Shanghai Tech University, School of Information Science and Technology, Shanghai, China (GRID:grid.440637.2) (ISNI:0000 0004 4657 8879)
3 Chinese Academy of Sciences, National Key Laboratory of Materials for Integrated Circuits, Shanghai Institute of Microsystem and Information Technology, Shanghai, China (GRID:grid.9227.e) (ISNI:0000000119573309); Chinese Academy of Sciences, Shanghai Advanced Research Institute, Shanghai, China (GRID:grid.9227.e) (ISNI:0000000119573309)
4 Chinese Academy of Sciences, Shanghai Advanced Research Institute, Shanghai, China (GRID:grid.9227.e) (ISNI:0000000119573309); Shanghai University, School of Life Sciences, Shanghai, China (GRID:grid.39436.3b) (ISNI:0000 0001 2323 5732)
5 Chinese Academy of Sciences, Shanghai Advanced Research Institute, Shanghai, China (GRID:grid.9227.e) (ISNI:0000000119573309); University of Chinese Academy of Sciences, Beijing, China (GRID:grid.410726.6) (ISNI:0000 0004 1797 8419)
6 Chinese Academy of Sciences, National Key Laboratory of Materials for Integrated Circuits, Shanghai Institute of Microsystem and Information Technology, Shanghai, China (GRID:grid.9227.e) (ISNI:0000000119573309)
7 Shanghai Tech University, School of Information Science and Technology, Shanghai, China (GRID:grid.440637.2) (ISNI:0000 0004 4657 8879)
8 Chinese Academy of Sciences, National Key Laboratory of Materials for Integrated Circuits, Shanghai Institute of Microsystem and Information Technology, Shanghai, China (GRID:grid.9227.e) (ISNI:0000000119573309); Chinese Academy of Sciences, Shanghai Advanced Research Institute, Shanghai, China (GRID:grid.9227.e) (ISNI:0000000119573309); University of Chinese Academy of Sciences, Beijing, China (GRID:grid.410726.6) (ISNI:0000 0004 1797 8419); University of Chinese Academy of Sciences, Chinese Academy of Sciences, School of Physics and Optoelectronic Engineering Hangzhou Institute for Advanced Study, Hangzhou, China (GRID:grid.410726.6) (ISNI:0000 0004 1797 8419)
Pages
139
Publication year
2023
Publication date
2023
ISSN
20961030
e-ISSN
20557434
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2886747164
Copyright
© The Author(s) 2023. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.