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GENEVA, Dec. 11 -- SHANGHAI METAPWR ELECTRONICS CO., LTD (Building C, No. 888, Huanhu West 2nd Road, Lingang New Area, China (Shanghai) Pilot Free Trade Zone Lingang Special AreaPudong New Area, Shanghai 201306), 上海沛塬电子有限公司 (中国上海市浦东新区中国(上海)自由贸易试验区临港新片区环湖西二路888号C楼) filed a patent application (PCT/CN2023/097285) for "WAFER-LEVEL POWER MODULE AND MANUFACTURING METHOD THEREFOR" on May 30, 2023. With publication no. WO/2023/232050, the details related to the patent application was published on Dec 07, 2023.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by...