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Abstract
Heat stress threatens global wheat (Triticum aestivum) production, causing dramatic yield losses worldwide. Identifying heat tolerance genes and comprehending molecular mechanisms are essential. Here, we identify a heat tolerance gene, TaSG-D1E286K, in Indian dwarf wheat (Triticum sphaerococcum), which encodes an STKc_GSK3 kinase. TaSG-D1E286K improves heat tolerance compared to TaSG-D1 by enhancing phosphorylation and stability of downstream target TaPIF4 under heat stress condition. Additionally, we reveal evolutionary footprints of TaPIF4 during wheat selective breeding in China, that is, InDels predominantly occur in the TaPIF4 promoter of Chinese modern wheat cultivars and result in decreased expression level of TaPIF4 in response to heat stress. These sequence variations with negative effect on heat tolerance are mainly introduced from European germplasm. Our study provides insight into heat stress response mechanisms and proposes a potential strategy to improve wheat heat tolerance in future.
Indian dwarf wheat (Triticum sphaerococcum) is thermotolerant, but the underlying mechanism is unclear. Here, the authors report the cloning of the heat tolerance gene encoding a STKc_GSK3 kinase and its variation affects phosphorylation level of downstream TaPIF4 in determining thermotolerance.
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Details
; Cui, Guangxian 1 ; Chen, Zhaoyan 1 ; Cheng, Xuejiao 1 ; Peng, Huiru 1
; Yao, Yingyin 1 ; Hu, Zhaorong 1
; Guo, Weilong 1
; Ni, Zhongfu 1
; Sun, Qixin 1
; Xin, Mingming 1
1 China Agricultural University, Frontiers science center for molecular design breeding, Key Laboratory of Crop Heterosis Utilization (MOE), Beijing, China (GRID:grid.22935.3f) (ISNI:0000 0004 0530 8290)




