Abstract

Optimizing thermoelectric conversion efficiency requires the compromise of electrical and thermal properties of materials, which are hard to simultaneously improve due to the strong coupling of carrier and phonon transport. Herein, a one-pot approach realizing simultaneous second phase and Cu vacancies modulation is proposed, which is effective in synergistically optimizing thermoelectric performance in copper sulfides. Multiple lattice defects, including nanoprecipitates, dislocations, and nanopores are produced by adding a refined ratio of Sn and Se. Phonon transport is significantly suppressed by multiple mechanisms. An ultralow lattice thermal conductivity is therefore obtained. Furthermore, extra Se is added in the copper sulfide for optimizing electrical transport properties by inducing generating Cu vacancies. Ultimately, an excellent figure of merit of ~1.6 at 873 K is realized in the Cu1.992SSe0.016(Cu2SnSe4)0.004 bulk sample. The simple strategy of inducing compositional and structural modulation for improving thermoelectric parameters promotes low-cost high-performance copper sulfides as alternatives in thermoelectric applications.

It is hard to simultaneously improve electrical and thermal properties of materials due to the strong coupling of carrier and phonon transport. Here, the authors propose a one-pot modulation strategy for simultaneously adjusting carrier and phonon transport in copper sulfids.

Details

Title
Synergistically optimized electron and phonon transport in high-performance copper sulfides thermoelectric materials via one-pot modulation
Author
Zhang, Yi-Xin 1 ; Huang, Qin-Yuan 1 ; Yan, Xi 1 ; Wang, Chong-Yu 1 ; Yang, Tian-Yu 1 ; Wang, Zi-Yuan 1 ; Shi, Yong-Cai 1 ; Shan, Quan 1   VIAFID ORCID Logo  ; Feng, Jing 1 ; Ge, Zhen-Hua 1   VIAFID ORCID Logo 

 Kunming University of Science and Technology, Faculty of Materials Science and Engineering, Kunming, China (GRID:grid.218292.2) (ISNI:0000 0000 8571 108X) 
Pages
2736
Publication year
2024
Publication date
2024
Publisher
Nature Publishing Group
e-ISSN
20411723
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
3013901867
Copyright
© The Author(s) 2024. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.