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© 2024 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

The growing demand for lightweight and durable materials in industries, such as the automotive, aerospace, and electronics industries, has spurred the development of heterojunction bilayer composites, combining the structural integrity of metals with the versatility of polymers. This study addresses the critical interface between stainless steel (SUS) and polyamide 66 (PA66), focusing on the pivotal role of surface treatments and various silane coupling agents in enhancing the adhesion strength of heterojunction SUS/PA66 bilayer composites. Through systematic surface modifications—highlighted by scanning electron microscopy, atomic force microscopy, and contact angle analyses—the study assessed the impact of increasing the surface area, roughness, and energy of SUS. X-ray photoelectron spectroscopy evaluations confirmed the strategic selection of specific silane coupling agents. Although some coupling agents barely influenced the mechanics, notably, aminopropyl triethoxysilane (A1S) and 3-glycidyl oxypropyl trimethoxysilane (ES) significantly enhanced the mechanical properties of the heterojunction bilayer composites, evidenced by the improved lap shear strength, elongation at break, and toughness. These advancements were attributed to the interfacial interactions at the metal–polymer interface. This research underscored the significance of targeted surface treatment and the judicious selection of coupling agents in optimizing the interfacial adhesion and overall performance of metal–polymer composites, offering valuable insights for the fabrication of materials where reduced weight and enhanced durability are paramount.

Details

Title
The Role of Surface Treatment and Coupling Agents for Adhesion between Stainless Steel (SUS) and Polyamide (PA) of Heterojunction Bilayer Composites
Author
Lee, Hayeong  VIAFID ORCID Logo  ; Song, Seung-In  VIAFID ORCID Logo  ; Keon-Soo Jang  VIAFID ORCID Logo 
First page
896
Publication year
2024
Publication date
2024
Publisher
MDPI AG
e-ISSN
20734360
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
3037523329
Copyright
© 2024 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.