Full Text

Turn on search term navigation

© 2024 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

The development of strong and ductile alloys for application in cryogenic temperatures has long been sought after. In this work, we have developed a face-centered cubic Ni10Co56.5V33.5 multi-principal element alloy (MPEA) that exhibits a balanced combination of high strength and good ductility at 77 K, based on the considerations of large local lattice distortion (LLD) and low stacking fault energy. The small-grained Ni10Co56.5V33.5 MPEA exhibits a yield strength of 1400 MPa and an ultimate tensile strength of 1890 MPa, while preserving a good ductility of 23%. Moreover, precession electron diffraction and transmission electron microscopy revealed multiple deformation mechanisms, including wavy dislocations, atypically severely twisted dislocation bands, hierarchical stacking faults, and deformation twins, which are implicated in the alloy’s outstanding mechanical performance. These insights offer a strategic guide for the design of strong and ductile alloys, particularly for utilization in extreme environments.

Details

Title
Tensile Properties of a Non-Equiatomic Ni–Co–V Medium Entropy Alloy at Cryogenic Temperature
Author
Zhou, Dawei 1 ; Shi, Caijuan 2 ; Wang, Caixia 1 ; Sheng, Ruixin 1 ; Li, Weidong 3 ; Yang, Tong 1 

 Institute for Advanced Studies in Precision Materials, Yantai University, Yantai 264005, China; [email protected] (D.Z.); [email protected] (C.W.); [email protected] (R.S.) 
 Synchrotron Radiation Facility, Institute of High Energy Physics, Chinese Academy of Sciences, Beijing 100049, China 
 Beijing Advanced Innovation Center for Materials Genome Engineering, University of Science and Technology Beijing, Beijing 100083, China 
First page
590
Publication year
2024
Publication date
2024
Publisher
MDPI AG
e-ISSN
20754701
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
3059575150
Copyright
© 2024 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.