Full Text

Turn on search term navigation

© 2024 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

Carbon-fiber-reinforced polyimide (PI) resin composites have gained significant attention in the field of continuous-fiber-reinforced polymers, in which the interfacial bonding between carbon fiber and matrix resin has been an important research direction. This study designed and prepared a water-soluble thermoplastic polyamide acid sizing agent to improve the wettability of carbon fiber, enhance the van der Waals forces between carbon fiber and resin and strengthen the chemical bonding between the sizing agent and the alkyne-capped polyimide resin by introducing alkyne-containing functional groups into the sizing agent. This study found that the addition of a sizing layer effectively bridged the large modulus difference between the fiber and resin regions, resulting in the formation of an interfacial layer approximately 85 nm thick. This layer facilitated the transfer of stress from the matrix to the reinforced carbon fiber, leading to a significant improvement in the interfacial properties of the composites. Adjusting the concentration of the sizing agent showed that composites treated with 3% had the best interfacial properties. The interfacial shear strength increased from 82.08 MPa to 108.62 MPa (32.33%) compared to unsized carbon fiber. This research is significant for developing sizing agents suitable for carbon-fiber-reinforced polyimide composites.

Details

Title
A Water-Soluble Thermoplastic Polyamide Acid Sizing Agents for Enhancing Interfacial Properties of Carbon Fibre Reinforced Polyimide Composites
Author
Huang, Chengyu 1   VIAFID ORCID Logo  ; Zhang, Peng 2   VIAFID ORCID Logo  ; Li, Bo 3 ; Sun, Mingchen 1 ; Liu, Hansong 2   VIAFID ORCID Logo  ; Sun, Jinsong 2 ; Zhao, Yan 1 ; Bao, Jianwen 2 

 School of Materials Science and Engineering, Beihang University, Beijing 100191, China; [email protected] (C.H.); [email protected] (M.S.) 
 Composite Technology Center, AVIC Manufacturing Technology Institute, Beijing 100012, China; [email protected] (P.Z.); [email protected] (H.L.); [email protected] (J.S.) 
 School of Optics and Photonics, Beijing Institute of Technology, Beijing 100811, China; [email protected] 
First page
2559
Publication year
2024
Publication date
2024
Publisher
MDPI AG
e-ISSN
19961944
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
3067504220
Copyright
© 2024 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.