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© 2024 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

Moore’s law states that the performance of computers doubles about every two years. This has dramatic consequences for any modern high development and for satellites. The long development cycles cause these expensive assets to be obsolete before the start of their operations. The advancement also presents challenges to their design, particularly from a thermal perspective, as more heat is dissipated and circuits are more fragile. These challenges mandate that faster spacecraft development methods are found and thermal management technologies are developed. We elaborate on existing development methodologies and present our own lean method. We explore the development of a thermal anomaly-detection payload, extending from conception to in-orbit commissioning, to stimulate discussions on space hardware development approaches. The payload consists of four miniaturized infrared cameras, heating sources in view of the cameras simulating an anomaly, an on-board processor, and peripherals for electrical and communication interfaces. The paper outlines our methodology and its application, showcasing the success of our efforts with the first-light activation of our cameras in orbit. We show our lean method, featuring reference technical and management models, from which we derive further development tools; such details are normally not available in the scientific-engineering literature. Additionally, we address the shortcomings identified during our development, such as the failure of an on-board component and propose improvements for future developments.

Details

Title
Lean Demonstration of On-Board Thermal Anomaly Detection Using Machine Learning
Author
Thoemel, Jan 1 ; Kanavouras, Konstantinos 1   VIAFID ORCID Logo  ; Maanasa Sachidanand 2 ; Hein, Andreas 1   VIAFID ORCID Logo  ; Ortiz del Castillo, Miguel 3   VIAFID ORCID Logo  ; Pauly, Leo 1   VIAFID ORCID Logo  ; Rathinam, Arunkumar 1   VIAFID ORCID Logo  ; Aouada, Djamila 1 

 Interdisciplinary Centre for Security, Reliability and Trust, University of Luxembourg, 4365 Esch-sur-Alzette, Luxembourg; [email protected] (K.K.); [email protected] (M.S.); [email protected] (A.H.); [email protected] (M.O.d.C.); [email protected] (A.R.); [email protected] (D.A.) 
 Interdisciplinary Centre for Security, Reliability and Trust, University of Luxembourg, 4365 Esch-sur-Alzette, Luxembourg; [email protected] (K.K.); [email protected] (M.S.); [email protected] (A.H.); [email protected] (M.O.d.C.); [email protected] (A.R.); [email protected] (D.A.); NXP Semiconductors, 06560 Valbonne, France 
 Interdisciplinary Centre for Security, Reliability and Trust, University of Luxembourg, 4365 Esch-sur-Alzette, Luxembourg; [email protected] (K.K.); [email protected] (M.S.); [email protected] (A.H.); [email protected] (M.O.d.C.); [email protected] (A.R.); [email protected] (D.A.); Melbourne Space Lab, University of Melbourne, Melbourne, VIC 3010, Australia 
First page
523
Publication year
2024
Publication date
2024
Publisher
MDPI AG
e-ISSN
22264310
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
3084697296
Copyright
© 2024 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.