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© 2024 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

This study uses annular circular rings to create multi-band applications using crescent-shaped patch antennas. It is designed to be made up of five circular, annular rings nested inside of each other. Three annular rings are positioned and merged on top of the larger rings, with two annular rings set along the bottom of the feed line. The factors that set them apart, such as bandwidths, radiation patterns, gain, impedance, and return loss (RL), are analysed. The outcomes show how compact the multi-band annular ring antenna is. The proposed circular annular ring antenna has return losses of −33 dB and operates at two frequencies: 3.1 GHz and 9.3 GHz. This design is modelled and simulated using ANSYS HFSS. The outcomes of the simulation and the tests agree quite well. The X band and WLAN resonant bands have bandwidth capacities of 500 and 4300 MHz, respectively. Additionally, the circular annular ring antenna design is advantageous for most services at these operating bands.

Details

Title
Dual Features, Compact Dimensions and X-Band Applications for the Design and Fabrication of Annular Circular Ring-Based Crescent-Moon-Shaped Microstrip Patch Antenna
Author
Aras, Unal 1 ; Tahesin, Samira Delwar 1   VIAFID ORCID Logo  ; Durgaprasadarao, P 2 ; P Syam Sundar 3 ; Shaik Hasane Ahammad 3   VIAFID ORCID Logo  ; Eid, Mahmoud M A 4   VIAFID ORCID Logo  ; Lee, Yangwon 5   VIAFID ORCID Logo  ; Zaki Rashed, Ahmed Nabih 6   VIAFID ORCID Logo  ; Ryu, Jee-Youl 1 

 Department of Smart Robot Convergence and Application Engineering, Pukyong National University, Busan 48513, Republic of Korea; [email protected] (U.A.); [email protected] (T.S.D.) 
 Department of EIE, V.R.Siddhartha Engineering College, Vijayawada 520007, India; [email protected] 
 Department of ECE, Koneru Lakshmaiah Education Foundation, Vaddeswaram 522302, India; [email protected] (P.S.S.); [email protected] (S.H.A.) 
 Department of Electrical Engineering, College of Engineering, Taif University, Taif 21944, Saudi Arabia; [email protected] 
 Department of Spatial Information Engineering, Pukyong National University, Busan 48513, Republic of Korea; [email protected] 
 Electronics and Electrical Communications Engineering Department, Faculty of Electronic Engineering, Menoufia University, Menouf 32951, Egypt; Department of VLSI Microelectronics, Saveetha School of Engineering, Saveetha Institute of Medical and Technical Sciences (SIMATS), Saveetha University, Chennai 602105, India 
First page
809
Publication year
2024
Publication date
2024
Publisher
MDPI AG
e-ISSN
2072666X
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
3085030715
Copyright
© 2024 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.