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© 2024 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

Elastic polymer-based conductive composites (EPCCs) are of great potential in the field of flexible sensors due to the advantages of designable functionality and thermal and chemical stability. As one of the popular choices for sensor electrodes and sensitive materials, considerable progress in EPCCs used in sensors has been made in recent years. In this review, we introduce the types and the conductive mechanisms of EPCCs. Furthermore, the recent advances in the application of EPCCs to sensors are also summarized. This review will provide guidance for the design and optimization of EPCCs and offer more possibilities for the development and application of flexible sensors.

Details

Title
Flexible Sensors Based on Conductive Polymer Composites
Author
Zhao, Dan 1 ; Jia, Weiwei 2 ; Feng, Xiaona 2 ; Yang, Huali 2   VIAFID ORCID Logo  ; Xie, Yali 2   VIAFID ORCID Logo  ; Shang, Jie 2   VIAFID ORCID Logo  ; Wang, Pengjun 3 ; Guo, Yufeng 4 ; Run-Wei Li 2 

 College of Integrated Circuit Science and Engineering, Nanjing University of Posts and Telecommunications, Nanjing 210023, China; [email protected]; CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China; College of Materials Science and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing 100049, China 
 CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China; College of Materials Science and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing 100049, China 
 College of Integrated Circuit Science and Engineering, Nanjing University of Posts and Telecommunications, Nanjing 210023, China; [email protected]; College of Electrical and Electronic Engineering, Wenzhou University, Wenzhou 325035, China 
 College of Integrated Circuit Science and Engineering, Nanjing University of Posts and Telecommunications, Nanjing 210023, China; [email protected] 
First page
4664
Publication year
2024
Publication date
2024
Publisher
MDPI AG
e-ISSN
14248220
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
3085062544
Copyright
© 2024 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.