Full text

Turn on search term navigation

© 2024 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

A SAW device with a multi-layered piezoelectric substrate has excellent performance due to its high Q value. A multi-layer piezoelectric substrate combined with phononic crystal structures capable of acoustic wave reflection with a very small array can achieve miniaturization and high performance. In this paper, a honeycomb-shaped phononic crystal structure based on 42°Y-X LT/SiO2/poly-Si/Si-layered substrate is proposed. The analysis of the bandgap distribution under various filling fractions was carried out using dispersion and transmission characteristics. In order to study the application of PnCs in SAW devices, one-port resonators with different reflectors were compared and analyzed. Based on the frequency response curves and Bode-Q value curves, it was found that when the HC-PnC structure is used as a reflector, it can not only improve the transmission loss of the resonator but also reduce the size of the device.

Details

Title
Honeycomb-Shaped Phononic Crystals on 42°Y-X LiTaO3/SiO2/Poly-Si/Si Substrate for Improved Performance and Miniaturization
Author
Tang, Panliang 1   VIAFID ORCID Logo  ; Pan, Hongzhi 2 ; Temesgen Bailie Workie 3   VIAFID ORCID Logo  ; Jia Mi 2 ; Bao, Jingfu 3   VIAFID ORCID Logo  ; Hashimoto, Ken-ya 3 

 School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China, No. 2006, Xiyuan Avenu, West Hi-Tech Zone, Chengdu 611731, China; [email protected] (P.T.); [email protected] (T.B.W.); [email protected] (K.-y.H.); CETC No. 26 Research Institute, 14#Huayuan Road, Nanping, Nanan District, Chongqing 400060, China 
 CETC No. 26 Research Institute, 14#Huayuan Road, Nanping, Nanan District, Chongqing 400060, China 
 School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China, No. 2006, Xiyuan Avenu, West Hi-Tech Zone, Chengdu 611731, China; [email protected] (P.T.); [email protected] (T.B.W.); [email protected] (K.-y.H.) 
First page
1256
Publication year
2024
Publication date
2024
Publisher
MDPI AG
e-ISSN
2072666X
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
3120791741
Copyright
© 2024 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.