Content area
Purpose
This study aims to address these challenges by enhancing the resistance of Ag-based pastes to corrosion and sulfurization, thereby improving their performance and weatherability in high-power and high-frequency electronic applications.
Design/methodology/approach
This study investigates the influence of Sn doping in W-doped Ag paste to enhance resistance against electrochemical corrosion and sulfurization. A systematic examination was conducted using transient liquid phase sintering and solid–liquid inter-diffusion techniques to understand the microstructural and electrochemical properties.
Findings
This study found that Sn addition in W-doped Ag paste significantly improves its resistance to electrochemical corrosion and sulfurization. The sintering process at 600°C led to the formation of an Ag2WO4 phase at the grain boundaries, which, along with the presence of Sn, effectively inhibited the growth of Ag2WO4 grains. The 0.5% Sn-doped samples exhibited optimal anti-corrosion properties, demonstrating a longer grain boundary length and a passivation effect that significantly reduced the corrosion rate. No Ag2S phase was detected in the weatherability tests, confirming the enhanced durability of the doped samples.
Originality/value
The findings of this study highlight the potential of Sn-doped Ag-W composites as a promising material for electronic components, particularly in environments prone to sulfurization and corrosion. By improving the anti-corrosion properties and reducing the grain size, this study offers a new approach to extending the lifespan and reliability of electronic devices, making a significant contribution to the development of advanced materials for high-power and high-frequency applications.
Details
Investigations;
Corrosion prevention;
Silver;
Sulfur;
Corrosion;
Electrochemical corrosion;
Outdoor air quality;
Intermetallic compounds;
Corrosion rate;
Corrosion resistance;
Pastes;
Sintering;
Corrosion tests;
Grain boundaries;
Electrochemical analysis;
Oxidation;
Grain growth;
Corrosion effects;
Interdiffusion;
Cellulose;
Grain size;
Temperature;
Solvents;
Corrosion potential;
Electronic components;
Liquid phase sintering;
Electrochemistry;
Sulfurization;
Morphology;
Shear strength;
Tin
1 Institute of Precision Electronic Components, National Sun Yat-sen University, Kaohsiung, Taiwan
2 Institute of Precision Electronic Components, National Sun Yat-sen University, Kaohsiung, Taiwan and Department of Electrical Engineering, National Sun Yat-sen University, Kaohsiung, Taiwan
3 Department of Material Engineering, National Pingtung University of Science and Technology, Neipu, Taiwan
4 Department of Biomedical Engineering, Johns Hopkins University, Washington, District of Columbia, USA