Image Processing Device, Image Processing System Including Image Processing Device, System-on-Chip Including Image Processing System, and Method of Operating Image Processing System

ALEXANDRIA, Virginia, Jan. 26 -- SAMSUNG ELECTRONICS CO., LTD., Suwon-si, South Korea has been assigned a patent (No. US 12206878 B2, initially filed Aug. 29, 2022) developed by three inventors Kyung-ah Jeong, Seoul, South Korea; Sun-young Shin, Yongin-si, South Korea; and Jin-hong Oh, Hwaseong-si, South Korea, for "Image processing device, image processing system including image processing device, system-on-chip including image processing system, and method of operating image processing system."

A system on a chip may include a codec module configured to receive an image including a plurality of first pixel data and output a plurality of second pixel data through a system bus. The codec module comprises at least one (M+N) bit logic circuit including M bit logic and N bit logic. The codec module is configured to operate in a first mode where the (M+N) bit logic circuit performs a dithering operation on the first pixel data of (M+N) bits and generates the second pixel data including at least M bits. The codec module is configured to operate in a second mode where the M-bit logic selectively operates and outputs the second pixel data of M bits.

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