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Recent advances in technologies such as blockchain, the Internet of Things (IoT), Cyber–Physical Systems (CPSs), and the Industrial Internet of Things (IIoT) have driven the digitalization and intelligent transformation of modern industries. However, embedded control devices within power system communication infrastructures have become increasingly susceptible to cyber threats due to escalating software complexity and extensive network exposure. We have seen that symmetric conventional patching techniques—both static and dynamic—often fail to satisfy the stringent requirements of real-time responsiveness and computational efficiency in resource-constrained environments of all kinds of power grids. To address this limitation, we have proposed a hardware-assisted runtime patching framework tailored for embedded systems in critical power system networks. Our method has integrated binary-level vulnerability modeling, execution-trace-driven fault localization, and lightweight patch synthesis, enabling dynamic, in-place code redirection without disrupting ongoing operations. By constructing a system-level instruction flow model, the framework has leveraged on-chip debug registers to deploy patches at runtime, ensuring minimal operational impact. Experimental evaluations within a simulated substation communication architecture have revealed that the proposed approach has reduced patch latency by 92% over static techniques, which are symmetrical in a working way, while incurring less than 3% CPU overhead. This work has offered a scalable and real-time model-driven defense strategy that has enhanced the cyber–physical resilience of embedded systems in modern power systems, contributing new insights into the intersection of runtime security and grid infrastructure reliability.
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; Zhang, Bo 1 ; Bhattacharjya Aniruddha 2
; Wang, Yunfan 1
; He, Chuan 1 1 State Grid Laboratory of Power Cyber-Security Protection and Monitoring Technology, State Grid Smart Grid Research Institute Co., Ltd., Nanjing 210003, China; [email protected] (Z.X.); [email protected] (Y.W.); [email protected] (C.H.)
2 Department of Electronic Engineering, Tsinghua University, Beijing 100190, China