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© The Author(s) 2025. This work is published under http://creativecommons.org/licenses/by/4.0/ (the "License"). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

Entanglement is paramount in quantum information processing. Many quantum systems suffer from spatial decoherence in distances over a wavelength and cannot be sustained over short time periods due to dissipation. However, long range solutions are required for the development of quantum information processing on chip. Photonic reservoirs mediating the interactions between qubits and their environment are suggested. Recent research takes advantage of extended wavelength inside near-zero refractive index media to solve the long-range problem along with less sensitivity on the position of quantum emitters. However, those recent proposals use plasmonic epsilon near-zero waveguides that are intrinsically lossy. Here, we propose a fully dielectric platform, compatible with the Nitrogen Vacancy (NV) diamond centers on-chip technology, to drastically improve the range of entanglement over 17 free-space wavelengths, or approximatively 12.5 µm, using mu near-zero metamaterials. We evaluate transient and steady state concurrence demonstrating an order of magnitude enhancement compared to previous works. This is, to the best of our knowledge, the first time that such a long distance is reported using this strategy. Moreover, value of the zero time delay second order correlation function g12(2)(0) are provided, showing antibunching signature correlated with a high degree of concurrence.

We propose a mu-near-zero index platform, a kind of near-zero refractive index materials, that enable long-range entanglement between on-chip quantum emitters. Transient and steady state concurrence demonstrating an order of magnitude enhancement compared to previous works.

Details

Title
Long-range quantum entanglement in dielectric mu-near-zero metamaterials
Author
Mello, Olivia 1 ; Vertchenko, Larissa 2 ; Nelson, Seth 3   VIAFID ORCID Logo  ; Debacq, Adrien 4 ; Guney, Durdu 5   VIAFID ORCID Logo  ; Mazur, Eric 1   VIAFID ORCID Logo  ; Lobet, Michaël 6   VIAFID ORCID Logo 

 John A. Paulson School of Engineering and Applied Sciences, Harvard University, 9 Oxford Street, 02138, Cambridge, MA, USA (ROR: https://ror.org/03vek6s52) (GRID: grid.38142.3c) (ISNI: 0000 0004 1936 754X) 
 Sparrow Quantum, 2000, Copenhagen, Denmark 
 Physics Department, Michigan Technological University, Houghton, MI, USA (ROR: https://ror.org/0036rpn28) (GRID: grid.259979.9) (ISNI: 0000 0001 0663 5937) 
 Department of Physics and Namur Institute of Structured Materials, University of Namur, Rue de Bruxelles 51, 5000, Namur, Belgium (ROR: https://ror.org/03d1maw17) (GRID: grid.6520.1) (ISNI: 0000 0001 2242 8479) 
 John A. Paulson School of Engineering and Applied Sciences, Harvard University, 9 Oxford Street, 02138, Cambridge, MA, USA (ROR: https://ror.org/03vek6s52) (GRID: grid.38142.3c) (ISNI: 0000 0004 1936 754X); Electrical & Computer Engineering Department, Michigan Technological University, Houghton, MI, USA (ROR: https://ror.org/0036rpn28) (GRID: grid.259979.9) (ISNI: 0000 0001 0663 5937) 
 John A. Paulson School of Engineering and Applied Sciences, Harvard University, 9 Oxford Street, 02138, Cambridge, MA, USA (ROR: https://ror.org/03vek6s52) (GRID: grid.38142.3c) (ISNI: 0000 0004 1936 754X); Department of Physics and Namur Institute of Structured Materials, University of Namur, Rue de Bruxelles 51, 5000, Namur, Belgium (ROR: https://ror.org/03d1maw17) (GRID: grid.6520.1) (ISNI: 0000 0001 2242 8479) 
Pages
300
Section
Article
Publication year
2025
Publication date
2025
Publisher
Springer Nature B.V.
e-ISSN
20477538
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
3246367666
Copyright
© The Author(s) 2025. This work is published under http://creativecommons.org/licenses/by/4.0/ (the "License"). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.