Springback simulation of non-isothermal electrical-assisted hot stamping for ultra-thin titanium bipolar plate

Abstract

Ultra-thin titanium bipolar plate with large depth/width ratio feature of micro channels has been used in flying hydrogen fuel cells, which meet the requirements of low weight and high energy density. However, the bipolar plate springback is more significant after stamping due to high yield-strength ratio of titanium sheet. Thus, a non-isothermal electrical-assisted hot stamping method was proposed to suppress the springback. Aiming to investigate forming process effects on titanium bipolar plate springback, the ingredients of heating transfer coefficient, forming temperature and forming rate were simulated and analyzed in this paper. Results show that thickness distribution and springback of titanium bipolar plate were strongly depended on the above-mentioned forming process factors. Based on the numerical results, the heating transfer coefficient, forming temperature and forming rate effects on springback were clarified.