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Conformal phased arrays promise shape-changing properties, multiple degrees of freedom in the scan angle, and applications for edge computing, including devices for wearable, airborne, and seaborne platforms. However, they have suffered from two critical limitations. (1) Although most applications require on-the-move communication and sensing, prior conformal arrays have suffered from dynamic deformation-induced beam pointing errors. This work introduces a dynamic beam-stabilized processor capable of beam adaptation through on-chip real-time control of fundamental gain, phase, and delay for each element. (2) Prior conformal arrays have leveraged additive printing to enhance flexibility, but conventional printable inks based on silver are expensive, and those based on copper suffer from spontaneous metal oxidation that alters trace impedance and degrades beamforming performance. Instead, we leverage a low-cost copper molecular decomposition ink with < 0.1% variation per °C across temperature and strain, and corrects any residual deformity in real-time using the dynamic beam-stabilized processor. Demonstrating unified material and physical deformation correction, our silicon-integrated dynamic beam-stabilized processor is low-power, low-area, and easily scalable due to tile-based architecture, thereby ideal for on-device implementations.
Authors present a flexible antenna array with a processor that stabilizes beams in real-time, addressing errors from dynamic deformation. It uses a cost-effective copper ink for printing, ensuring stable performance under strain and temperature changes, suitable for wearable and portable devices.
Details
Deformities;
Humidity;
Beamforming;
Microprocessors;
Copper;
Edge computing;
Silver;
Wearable technology;
Unmanned aerial vehicles;
Deformation effects;
Oxidation;
Inks;
Field programmable gate arrays;
Aircraft;
Temperature;
Antennas;
Microstrip antennas;
Phased arrays;
Portable equipment;
Drones;
Errors;
Arrays;
Algorithms;
Deformation;
Real time
; Islam, Abdullah 2 ; Rao, Arpit 1
; Bansal, Shrestha 1
; Dabrowski, Ted 3 ; Kwan, Kalsi 3 ; Wang, Zhongxuan 2
; Mishra, Amit Kumar 4 ; Navarro, Julio A. 5 ; Ren, Shenqiang 2
; Williams, John D. 3 ; Shekhar, Sudip 4
; Gupta, Subhanshu 1
1 School of Electrical Engineering and Computer Science, Washington State University, Pullman, WA, USA (ROR: https://ror.org/05dk0ce17) (GRID: grid.30064.31) (ISNI: 0000 0001 2157 6568)
2 Department of Materials Science and Engineering, University of Maryland, College Park, MD, USA (ROR: https://ror.org/047s2c258) (GRID: grid.164295.d) (ISNI: 0000 0001 0941 7177)
3 Boeing Research and Technology, The Boeing Company, Hunstville, AL, USA (ROR: https://ror.org/04sm5zn07) (GRID: grid.423121.7) (ISNI: 0000 0004 0428 1911)
4 Department of Electrical and Computer Engineering, University of British Columbia, Vancouver, BC, Canada (ROR: https://ror.org/03rmrcq20) (GRID: grid.17091.3e) (ISNI: 0000 0001 2288 9830)
5 Boeing Research and Technology, The Boeing Company, Seattle, WA, USA (ROR: https://ror.org/04sm5zn07) (GRID: grid.423121.7) (ISNI: 0000 0004 0428 1911)