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1. Introduction
The electronics industry has been the largest industry since 1996 and would be a $1.5 trillion (i.e. $1.5×1012 ) industry by 2010 ([1] Lau, 2011). The most important invention of the electronics industry is, arguably the transistor, which earned John Bardeen, Walter Brattain, and William Shockley the 1956 Nobel Prize in Physics.
Through-silicon via (TSV) is the heart of 3D integration technology ([2] Lau et al. , 2010a). Figure 1 [Figure omitted. See Article Image.] shows the patent "Semiconductive wafer and method of making the same" filed on October 23, 1958 and granted on July 17, 1962 by William Shockley. Yes, the same William Shockley, who co-invented the greatest invention of all times in electronics industry - the transistor. Please see "Who invented TSV and when?" posted at 3D InCites on April 24, 2010 (www.semineedle.com/posting/31171).
TSV for 3D integration is a more than 26-year-old technology ([1] Lau, 2011). Even Shockley invented TSV more than 50 years ago, but it was not for 3D integration. In this investigation, TSV (with a new concept that every chip could have two surfaces with circuits) is the focus. A 3D integration roadmap is also provided.
2. 3D IC packaging technology
3D IC packaging consists of two or more conventional components (packages) stacked in the vertical direction. The most common is 3D memory stack (Figures 2 and 3 [Figure omitted. See Article Image.]) by stacking up memory chips with wire bonds and die attachments. Recently, 28-chip memory stack is not uncommon. Package-on-package (PoP) such as a flip chip with solder bumps attached to a substrate which is supporting two stacked chips with wire bonds, is shown in Figure 3 [Figure omitted. See Article Image.]. 3D memory stack and PoP are mature technologies and in high-volume production as shown in the maturity status of 3D integration technology (Figure 2 [Figure omitted. See Article Image.]) and the 3D integration roadmap (Figure 3 [Figure omitted. See Article Image.]) (b3 b5 b4 b9 b8 b1 Lau, 2009a, b, c, 2010a, b, 2011; [2], [6] Lau et al. , 2010a, b; [7] Lau and Tang, 2009), and thus will not be discussed herein.
3. 3D IC integration technology
As shown in Figure 4 [Figure omitted. See Article Image.] (b3 b5 b4 b9...